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LED Components Reliability

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LED flashlight components reliability depends mainly on two parts: the extension of the chip and device packaging quality performance, the two kinds has completely different failure mechanism, and we described respectively.

The extension of the chip failure: influence the performance and quality of extension, mainly and extension of layer especially P-n “part of the dislocation and defect of the number and distribution, metal and semiconductor contact layer mass, and the extension of the chip surface layer and surrounding contamination cause and condition about the number of ions. Chip in heating, electric conditions, will gradually cause a wrong, defect, surface and surrounding an electric drift and ion thermal diffusion, make the chip failure, it is the essence of the above failure. To improve the extension of the chip reliability index, fundamentally to reduce produces in the process of growth dislocation and defects and extension of the surface of and surrounding contamination, improve the metal and semiconductor contact quality, so as to improve the service life of the time. At present there are reports, naked chip to make accelerated life tests, and calculated, general life 100000 hours, even hundreds of thousands of hours.

The failure of the device packaging: there are reports say: LED about 70% above is device failure caused by packaging, so packaging technology to LED device is the key technical it. The device packaging technology LED in the article [3] and [4] in detail, so in this paper not only brief analysis about LED device package reliability problems. LED by the failure of the package is affiliate failure, its reason is very complex, the main sources of three parts:

1: packaging materials not beautiful causes, such as epoxy, silica gel, phosphor, base, conductive rubber, solid crystal material, etc.

2: package structure design is not reasonable, such as materials do not match, the stress caused by fracture, and opens, etc.

3: encapsulation technology not appropriate, such as or sheet, bonding, glue process, curing temperature and time, etc.

In order to improve the device packaging reliability, first in material selection aspects to strictly control quality of materials, in the package structure except consider a light on efficiency and heat outside, also want to consider the various materials together the heat when the matching problem. In the packaging process, want to strictly control the process flow of every working procedure, as far as possible using automated equipment, to ensure the consistency of the process and repeatability, security and reliability index performance LED device.

At present domestic LED drive power have more quality problem, according to the report, LED lamps failure, about 70% above is caused by driving power, this question should cause the attention of this industry. Power transformation: high voltage variable low pressure, communication, change voltage dc, steady flow.

The protection circuit: protection circuit content too, such as over-voltage protection, overheating protection, short circuit protection, LED flashlight output open protection, low voltage latch, restrain electromagnetic interference, conduction noise, anti-static, lightning, the surge, the harmonic oscillation, etc.

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